SUMIKASUPER LCP Adhesion

SUMIKASUPER LCP is a commercially available adhesive (Table 5-6-1) that can be bonded without any special surface treatment. The adhesive surface retains a practical adhesive strength even after heat aging at 250°C. In addition, while crystalline resins such as PPS may warp when cured at high temperatures, SUMIKASUPER LCP hardly warps even when cured at high temperatures of 120-150°C, so processing can be done in a short time. For recommendations on how to use a specific adhesive, please contact the adhesive manufacturer.

Adhesive strength test method

  • Figure 5-6-1 Test method for adhesive strength

    Figure 5-6-1 Test method for adhesive strength

The test conditions are as follows:

  • Test specimen
    ASTM No. 1 test piece (thickness 3.2 mm)
  • Test Method
    After applying adhesive to the test pieces, they are overlapped by 10 mm and cured in a hot air circulating oven.
  • Strength measurements
    Tensile speed 1.67×10-4 Measure the shear strength in m/s.

Table 5-6-1 Adhesive strength of SUMIKASUPER LCP with commercially available adhesives

(Unit: MPa)

  Glue
TB2234D
(ThreeBond)		 Sumimac ECR-9173K
(Sumitomo Bakelite)
After curing 250℃, 1hr
Thermal aging		 230℃, 1min
IR Reflow		 After curing 250℃, 1hr
Thermal aging
E5008 9.2 3.0 9.2 9.1 3.8
E6008 7.7 2.8 7.8 8.8 3.5
  Glue
Technodyne AH 7052T
(Taoka Chemicals)		 Technodyne AH 6072K
(Taoka Chemicals)		 Technodyne AH 062K
(Taoka Chemicals)
After curing 250℃, 1hr
Thermal aging		 After curing 250℃, 1hr
Thermal aging		 After curing 250℃, 1hr
Thermal aging
E5008 6.2 4.6 6.7 4.3 6.6 3.8
E6008 7.0 4.4 6.1 4.2 5.6 5.0