SUMIKASUPER LCP connector applications

SUMIKASUPER LCP Selection Guide for Connector Applications

Required material properties

In recent years, the most common method for mounting electronic components to circuit boards is surface mount technology (SMT), in which components are soldered in a high-temperature atmosphere of 250 to 270°C. For SMT-compatible connectors, LCP is widely used, due to its excellent heat resistance, dimensional stability, and precision moldability.
In addition, as electronic devices become more powerful and smaller, connectors that connect boards and FPC (Flexible Printed Circuit) boards to cables and other boards are required to have higher density, more cores, smaller size, thinner size, and higher transmission speeds, and the characteristics required of the LCPs used are becoming more advanced. Furthermore, there are many types of connectors depending on the purpose of the connection, and the characteristics required of the LCP also differ. We develop high-performance, high-function grades to meet the needs of our customers and offer a diverse lineup.

Grade lineup for connector applications

The grade lineup of SUMIKASUPER LCP for connector applications is as follows. Each grade has the thin-wall flow, thin-wall strength, and low warpage required for connectors.

Table 6-2-1 Connector grade lineup

Filler Features E Series
standard
E/SV Series
General purpose/functional
SZ/SR series
High functionality
Glass fiber standard E6007LHF E6007LHF-MR SR1009
SR1009L
Glass fiber/inorganic
or
Inorganic alone
Low warpage standard E6807LHF
E6808LHF
SV6808THF
SV6808L
SZ6505HF
SZ6506HF
High flow E6808UHF
E6808GHF
SV6808GHF SR2506
Low anisotropy E6810LHF
E6810KHF
E6809U SR2507
SZ4506
Glass fiber/Inorganic Low dielectric constant and low dielectric tangent E4205R E6205L SR1205L

Connector grade properties

(1) Thin-walled fluidity

The fluidity of SUMIKASUPER LCP for thin walls of 0.10mm, 0.12mm, 0.15mm, 0.20mm, and 0.30mm is shown below. SUMIKASUPER LCP shows the highest level of fluidity among many LCPs.

Figure 6-2-1 Thin-wall flow length measurement mold

Figure 6-2-1 Thin-wall flow length measurement mold

Figure 6-2-2 SUMIKASUPER LCP Thin-wall Fluidity 1

Figure 6-2-2 SUMIKASUPER LCP Thin-wall Fluidity 1

Figure 6-2-3 SUMIKASUPER LCP Thin-wall Fluidity 2

Figure 6-2-3 SUMIKASUPER LCP Thin-wall Fluidity 2

(2) Thin-wall strength

The thin-wall strength of SUMIKASUPER LCP for connector grades of 0.10 mm, 0.20 mm, and 0.30 mm is shown below. SUMIKASUPER LCP exhibits high mechanical strength even in thin-walled grades of 0.30 mm or less.

Figure 6-2-4 Thin-wall strength measurement test method

Figure 6-2-4 Thin-wall strength measurement test method
Test piece shape : Plate test piece
Test piece width :5mm
Test piece thickness : 0.10, 0.20, 0.30mm
Support distance :3mm (0.10mm), 5mm (0.20mm, 0.30mm)
Test Speed :2mm

Figure 6-2-5 Thin-wall strength of SUMIKASUPER LCP

Figure 6-2-5 Thin-wall strength of SUMIKASUPER LCP

(3) Low warpage

In SMT connectors, the expansion and contraction of the LCP resin due to heating in the reflow process and the release of residual stress in the resin can cause the connector to warp and deform, resulting in defective soldering. SUMIKASUPER LCP grades for connector applications have excellent low warpage properties, even before and after heating in the reflow process.

Figure 6-2-6 FPC model connector and reflow test conditions

Figure 6-2-6 FPC model connector and reflow test conditions

Warpage measurement method
Measuring device: Core9030C (manufactured by Cores Corporation)
Reflow conditions: See below
Measurement method: The amount of warpage of the FPC model connector before and after reflow was calculated.
Method for calculating the amount of warping: The heights of lines A-A' and B-B' connecting both ends in the longitudinal direction were measured, and the least squares plane of the connector was calculated using the least squares method. The distance between the lowest point and the highest point was calculated as the amount of warping.

Figure 6-2-6 FPC model connector and reflow test conditions

Figure 6-2-7 SUMIKASUPER LCP model connector warpage

Figure 6-2-7 SUMIKASUPER LCP model connector warpage

Grade Selection Guide for Connector Applications

There are many types of connectors depending on the purpose of the connection, and the characteristics required of the material also vary. When selecting a grade, it is necessary to select an appropriate grade based on the required characteristics and shape of the connector (especially the thickness of the molded product). Below are listed the representative connector types and recommended grades. There are also the latest grades that are not listed in the catalog, so please contact our staff for grade selection and other technical inquiries.

Table 6-2-2 Recommended grades for SUMIKASUPER LCP by connector

Connector Type Connector type Recommended Grade Features
□Micro connector (0.3 to 0.4 mm pitch)
・Board to board connector housing
・Board to FPC connector housing
・FPC connector housing
Ultra-compact/fine pitch/low profile
E6808UHF
E6808GHF
SV6808THF
SV6808GHF
SZ6505HF
SR2506
SR2507
High flow, low warpage, blister resistance
High flow, low warpage, high strength
High flow and ultra-low warpage
High flow, low warpage, high thin wall strength
Ultra-high flow and low warpage
Ultra-high flow, low warpage, high weld
Ultra-high flow, ultra-low warpage, low linear expansion
□Card connector
・SIM card connector housing
・SD card connector housing
・2 in 1, 3 in 2 card connector housing
Flat/Ultra-thin/Insert
E6808UHF
SV6808THF
SV6808GHF
SZ6505HF
SZ6506HF
SR2506
SR2507
High flow, low warpage, blister resistance
High flow and ultra-low warpage
High flow, low warpage, high thin wall strength
Ultra-high flow and low warpage
Ultra-high flow and ultra-low warpage
Ultra-high flow, low warpage, high weld
Ultra-high flow, ultra-low warpage, low linear expansion
□Card edge (DDR, M2, S-ATA) connector
・DDR connector housing
・M2 (NGFF) connector housing
・S-ATA connector housing
Uniaxial long shape/High strength
E6808UHF
SV6808THF
E6808LHF
E6809U
E6810KHF
E6810LHF
High flow, low warpage, blister resistance
High flow and ultra-low warpage
High flow, low warpage, high strength
Low warpage, low anisotropy, blister resistance
Low warpage and low anisotropy
Low warpage and low anisotropy
□I/O Connector
・USB connector housing
・HDMI connector housing
・I/O connector related housing
Small size/high density/robustness/high speed transmission
E6807LHF
E6808LHF
E6808UHF
SV6808THF
SV6808GHF
E6809U
E6810KHF
High flow, low warpage, high strength
High flow, low warpage, high strength
High flow, low warpage, blister resistance
High flow and ultra-low warpage
High flow, low warpage, high thin wall strength
Low warpage, low anisotropy, blister resistance
Low warpage and low anisotropy
□Board-to-board connectors, floating connectors
・Board to board connector housing
・Floating connector housing
・Board to cable connector housing
・Automotive connector housing
Rectangular/Robust/Heat-resistant/High-speed transmission
E6006L
E6008
E6007LHF
E6007LHF-MR
E6807LHF
SV6808THF
Standard/High strength
Standard/High flow
High fluidity and high strength
High flow, high strength, and mold release
High flow, low warpage, high strength
High flow and ultra-low warpage
□CPU socket connector
・CPU socket connector housing
Flat/Grid/Heat-resistant
E6007LHF
E6807LHF
E6808UHF
SV6808L
High fluidity and high strength
High flow, low warpage, high strength
High flow, low warpage, blister resistance
High heat resistance and high strength
□High-speed transmission connectors, coaxial connectors
・Coaxial connector housing
- High-speed transmission FPC connector
・Backplane connector for high speed transmission
・Mezzanine connector
Rectangular/High density/Robust/High speed transmission
E6808UHF
SV6808THF
SZ6506HF
SR2506
SR2507
E6205L
SR1205L
High flow, low warpage, blister resistance
High flow and ultra-low warpage
Ultra-high flow and ultra-low warpage
Ultra-high flow, low warpage, high weld
Ultra-high flow, ultra-low warpage, low linear expansion
Low Dielectric
Low dielectric constant and low dielectric tangent