Deflection temperature under load

The approximate deflection temperature under load (DTUL) for each grade of SUMIKASUPER LCP is as follows.
The deflection temperature under load can be used as a general indicator for short-term heat resistance. Keep in mind that the results are from tests performed at different measured stresses (0.45MPa and 1.82MPa).

Table 3-1-1 DTUL of SUMIKASUPER LCP

Under Load	0.45MPa	1.82MPa
E5000 series	350-390°C	330-360°C
E4000 series	330-340°C	300-320°C
E6000 series SV6000 series SR1000 series	300-320°C	270-290°C
E6000HF series SV6000HF series	280-320°C	250-280°C
SZ6000HF series SR2000 series	270-300°C	240-270°C

Continuous Service Temperature and DTUL

SUMIKASUPER LCP has an excellent balance between the continuous service temperature and DTUL.

Figure 3-1-1 Continuous Service Temperature and DTUL (1.82MPa)

Thermal Decomposition Temperature

The results from TGA (Thermogravimetric Analysis) indicate that the temperature of thermal decomposition in nitrogen is quite high, being approximately 450°C, and the decrease in mass at a temperature of 500°C is extremely small (only 1%). Therefore, SUMIKASUPER LCP can be seen to exhibit high thermal stability.

Dynamic viscoelasticity (DMA)

The following data show the temperature dependence of dynamic viscoelasticity for the elastic modulus for comparing SUMIKASUPER LCP, crystalline polymers (PEEK), and amorphous polymers (PES). For PEEK, there is a significant decrease in the elastic modulus at 140°C, while LCP maintains high mechanical properties even at 200°C and above without showing glass transition behavior. Thermal analysis using a differential scanning calorimeter (DSC) also indicates no thermal transition (Tg) that is seen with conventional crystalline and amorphous polymers. There is also no clear melting point observed with SUMIKASUPER LCP. SUMIKASUPER LCP appears to melt at the liquid crystallization temperature (Tlc). This indicates that the tool temperature can be set widely up to the molding temperature.

Figure 3-1-3 Dynamic viscoelastic curve Curve of SUMIKASUPER LCP

Hot Water Resistance

It maintains practical strength even after immersion for 2,000 hours in water at 80°C. It cannot be used in water vapor of 120°C or higher since susceptibility to hydrolysis increases and strength is greatly reduced.

Figure 3-1-4 Hot Water Resistance of SUMIKASUPER LCP (80°C)

Soldering Heat Resistance

SUMIKASUPER LCP possesses the highest soldering heat resistance among all heat-resistant engineering plastics.

Table 3-1-3 Soldering Heat Resistance of SUMIKASUPER LCP

Sample size:	JIS K7113 No. 1(1/2) dumbbell x 1.2mm
Solder:	H60A (60% tin, 40% lead)

*The values within the above table represent the limit, in seconds (">60" means the product will not deform, even when dipped in a solder bath for 60 seconds).
Blistering may occur, even in temperatures less than the above deformation temperatures, depending on the molding condition.

Long-Term Heat Resistance

SUMIKASUPER LCP has excellent long-term heat resistance. The following data show the relative temperature index (RTI) for SUMIKASUPER LCP. The RTI indicates the temperature at which the impact strength (Imp) and tensile strength (Str) of the electrical properties (Elec) and mechanical properties (Mech) become half their initial values after the material is aged 100,000 hours. Generally, deterioration is faster for thin test pieces, so RTI evaluation for UL is performed according to the thickness of the test piece.

Table 3-1-4 Relative Temperature Index of SUMIKASUPER LCP (UL 746B)

Grade	Thickness (mm)	RTI
		Elec	Imp	Str
E5008	0.75	240	200	220
	1.5	240	220	240
	3.0	240	220	240
E5008L	0.75	240	200	220
	1.5	240	220	240
	3.0	240	220	240
E4008	0.15	220	200	220
	0.30	240	200	240
	0.75	240	220	240
	1.5	240	220	240
	3.0	240	220	240
E6008	0.15	220	200	220
	0.27	240	200	240
	0.54	240	220	240
	0.75	240	220	240
	1.5	240	220	240
	3.0	240	220	240
E6007LHF-MR	0.50	220	210	210
	0.75	220	210	210
	1.5	220	220	220
	3.0	220	220	220

Arrhenius Plot

The temperature range where the resin can be used for a long time is limited by the thermal stability of the resin. According to the UL-compliant RTI evaluation, the aging test continues until the observable target property value becomes half the initial value. Perform aging tests at several different temperatures and create an Arrhenius plot based on that data. An Arrhenius plot is a graph created by plotting the heat aging time (also called half-life) required for the property value to reach half the initial value against the reciprocal of the aging temperature (K).

Heat aging resistance (260°C in air)

The following figure shows the strength retention performance of SUMIKASUPER LCP in air at 260°C. There is almost no loss of tensile strength, even in air at 260°C.

Figure 3-1-7 Resistance to after heat aging (260°C in air)