SUMIKASUPER LCP Selection Guide for Electrical and Electronic Components

Grade lineup

The features of the main grades of SUMIKASUPER LCP are shown below. When selecting a grade, first select the series you will use based on the heat resistance required for your application.

(1) E5000 Series

The E5000 series has the highest level of heat resistance among super engineering plastics. Please use it when lead-free solder (dipping) is below 400℃, especially when ultra-high heat resistance is required. However, because it has ultra-high heat resistance, the molding processing temperature is also high, so care must be taken to use molding machines with high temperature specifications and to require regular maintenance.

(2) E4000 Series

The E4000 series is a grade with excellent moldability and high heat resistance. Please use it when heat resistance of 380℃ or less is required for lead-free solder (dipping) such as bobbins and relay cases. Since the standard molding temperature is 380℃, molding can be done with a molding machine of standard specifications.

(3) E6000 series, E6000HF series, SV6000 series, SV6000HF series

Our standard grades, E6000 series, E6000HF series, SV6000 series, and SV6000HF series, are well-balanced grades that have high mechanical properties and dimensional stability comparable to general-purpose engineering plastics, as well as high moldability, in addition to heat resistance sufficient to withstand surface mounting (SMT) of electronic components. They can be used in a wide range of applications. For applications requiring high dimensional stability and high moldability, please select the E6000HF or SV6000HF series, which have excellent fluidity.

(4) SZ Series, SR Series

The SZ series and SR series are special high-performance compound series with functionality not found in existing grades, developed from a base LCP resin for specific applications such as connectors and LEDs. For applications requiring high fluidity such as ultra-small parts where even E6000HF or SV6000HF does not have sufficient fluidity, please select SZ6505HF or SR2506, which have the highest level of high fluidity among LCPs.

How to select each grade

(1) Glass fiber reinforced grade

Glass fiber reinforced LCP grades have excellent mechanical strength and heat resistance. Properties such as mechanical strength, heat resistance, dimensional stability, and moldability change depending on the length and filling amount of the glass fibers.

• If mechanical strength and dimensional stability are required, please select grades that use chopped glass fiber (long glass fiber) and have an "L" such as E5008L, E4006L, E6006L, E6007LHF, etc. If high strength is required, please consider SR1009 and SR1009L of the SR series, which have the highest level of mechanical strength among LCPs.
• If high heat resistance or high moldability is required, please consider E5008, E4008, E6008, etc., which use milled GF (ground glass fiber).

Table 6-1-1 Glass fiber reinforced grades of SUMIKASUPER LCP

	E5000 series	E4000 series	E6000 Series SV6000 Series	E6000HF Series SV6000HF Series	SZ/SR series
Heat resistance requirement level	Special ultra-high heat resistance	Ultra-high heat resistance	High heat resistance	High flow	High functionality
Features	Dip solder resistance High temperature reflow resistance Rigidity when heated to 200℃ or higher	High temperature reflow resistance Rigidity when heated to 200℃ or higher	Reflow resistance standard	Reflow resistance High flow Low warpage	Reflow resistance High functionality Specialized use
Standard molding temperature (℃)	400	380	360	350	340～380
Milled GF Thin and small	E5008 E52008	E4008 E4009	E6006 E6008	-	SR1009
Chopped GF High strength	E5006L E5008L	E4006L	E6006L	E6007LHF E6007LHF-MR	SR1009L

(2) Glass fiber/Inorganic reinforced grade

Grades of LCP reinforced with glass fiber and inorganic fillers combine distinctive inorganic fillers with glass fiber to provide high dimensional stability, low warpage, and high fluidity without compromising mechanical strength or heat resistance.

Table 6-1-2 SUMIKASUPER LCP glass fiber/inorganic reinforced grades

	E5000 series	E4000 series	E6000 Series SV6000 Series	E6000HF Series SV6000HF Series	SZ/SR series
Heat resistance requirement level	Special ultra-high heat resistance	Ultra-high heat resistance	High heat resistance	High flow	High functionality
Features	Dip solder resistance High temperature reflow resistance Rigidity when heated to 200℃ or higher	High temperature reflow resistance Rigidity when heated to 200℃ or higher	Reflow resistance standard	Reflow resistance High flow Low warpage	Reflow resistance High functionality Specialized use
Standard molding temperature (℃)	400	380	360	350	340～380
Glass fiber/Inorganic reinforcement	E5204L	E4205R	E6205L	-	SR1205L SZ6709L
Glass fiber/Inorganic reinforcement High flow and low warpage	-	-	E6809U SV6808L	E6807LHF E6808LHF E6808UHF E6808GHF SV6808THF SV6808GHF E6810LHF E6810KHF	SR2506

(3) Inorganic reinforced grade

In general, inorganic reinforced grades have superior surface properties, higher tensile elongation, and impact strength compared to glass fiber reinforced grades. They also have high flow properties.

Table 6-1-3 Inorganic reinforced grades of SUMIKASUPER LCP

	E5000 series	E4000 series	E6000 Series SV6000 Series	E6000HF Series SV6000HF Series	SZ/SR series
Heat resistance requirement level	Special ultra-high heat resistance	Ultra-high heat resistance	High heat resistance	High heat resistance	High functionality
Features	Dip solder resistance High temperature reflow resistance Rigidity when heated to 200℃ or higher	High temperature reflow resistance Rigidity when heated to 200℃ or higher	Reflow resistance standard	Reflow resistance High flow Low warpage	Reflow resistance High functionality Specialized use
Standard molding temperature (℃)	400	380	360	350	340～380
Inorganic	-	-	E6807T E6809T	-	SZ4506 SZ6505HF SZ6506HF SR2507