SUMIKASUPER LCP can be molded using both the standard inline type and plunger (preplasticating) type of injection molding machines.
However, for E5000 series, it requires a higher molding temperature (up to 420°C), and thus the injection molding machine with high temperature specifications (450°C) is required.
Since the properties of SUMIKASUPER LCP molded products are highly dependent on the resin temperature during molding (cf. Figure 4-1-2), it is necessary to mold SUMIKASUPER LCP at an appropriate resin temperature. On the other hand, as the standard molding temperature for SUMIKASUPER LCP is extremely high (320 to 400°C), there may be a discrepancy between the setting temperature of the molding machine and the actual resin temperature. In this case, the potential of SUMIKASUPER LCP can not be fully utilized.
In order to prevent such problems, it is recommended that the resin temperature in the cylinder be monitored. The actual resin temperature can be measured, for example, by using an infrared radiation thermometer that can measure the temperature of a small area.
Figure 4-3-1 Measuring Method of Resin Temperature
As SUMIKASUPER LCP has a rapid solidification nature when cooled, it does not easily cause flashes during injection molding although its melt viscosity is very low.
However, when molding ultra-thin-walled products (< 0.2mm), there are cases where the resin solidifies in the thin-walled part and sufficient flow length cannot be obtained. As a countermeasure in such cases, the injection molding machines with high speed and excellent injection response characteristics, such as electric injection molding machines or hydraulic injection molding machines with accumulators, are effective.
Figure 4-3-2 Maximum Flow Length without Flash Generation
Hydraulic injection molding machine : | UH-1000 (Nissei Plastic Industrial Co., Ltd.) |
Electric injection molding machine : | SE/SV series (Sumitomo Heavy Industries, Ltd.) |
Electric injection molding machine : | FANUC ROBOSHOT -Si series (FANUC Corporation) |
Electric injection molding machine : | LP/TR series (Sodick Co., Ltd.) |
Figure 4-3-3 Comparison of Injection Response Characteristics
(As shown above, when compared to general-purpose molding machine, the high speed molding machine provides the high injection speed in the initial period and thereafter molding is performed at the specified injection speed.)
Flow Length Measurement Mold : | Use the one shown in Figure 4-3-5 |
Molding temperature : | 360°C Grade : E6008 Injection speed 100mm/sec V-P switching pressure 60MPa |
General-purpose molding machine : | PS-40E5 ASE (Nissei Plastic Industrial Co., Ltd.) Injection speed 90% Injection pressure 90MPa |
When SUMIKASUPER LCP is molded by injection molding, its molecules can be easily oriented in the flow direction due to shear flow. As a result, a molded product with high strength and modulus can be obtained, but at the same time, it must also possess anisotropy.
It is important to pay close attention to how the flow pattern in the cavity will be when designing the mold.
Figure 4-3-4 Sprue Diagram
Figure 4-3-5 Mold for Thin-Wall Flow Length Measurement (Unit : mm)
Product thickness : 0.3mm
Flow length is 4 cavities average
Figure 4-3-6 Thin-Wall Flow Length
As the weld strength of SUMIKASUPER LCP is lower than that of other engineering plastics, it is necessary to limit the number of gates to only 1 to 2 places and give careful consideration to where to locate the gate, in order to avoid the formation of welds.
Figure 4-3-7 Gate Diagram
During long-term continuous molding, resin can remain in dead spaces inside the molding machine, and the remaining resin may deteriorate or become colored. LCP can easily remain in such dead spaces since it has an extremely low melt viscosity. Therefore, when applying hot runners, it is necessary to pay sufficient attention to prevent black spots and cold slag caused by resin retention.
When selecting a hot runner for SUMIKASUPER LCP, please take note of the following points.
The system must be capable of producing high levels of heating with a uniform temperature distribution.
Heater integrated type is preferable. The manifold and nozzle temperatures should not be maintained too high.
The areas coming into contact with the mold (gate areas) must be maintained at high temperatures.
Table 4-3-1 Temperature Specifications of Hot Runner
Temperature specification of hot runner (MAX) | |
---|---|
E6000HF series | up to 370°C |
E6000 series | up to 380°C |
E4000 series | up to 400°C |
E5000 series | up to 420°C |
Table 4-3-2 Application of Hot Runners to SUMIKASUPER LCP
Runner part | Gate seal | Application to SUMIKASUPER LCP |
Remarks | ||||||
---|---|---|---|---|---|---|---|---|---|
Internal heating |
External heating |
Open | Valve Gate |
Thermal seal |
Full hot runner (runner-less) |
Sprueless molding |
|||
JU-OH INC. 614 System |
- | - | - | - | G | φ4 Electromagnetic induction heating |
|||
DMK JAPAN Inc. Mini Runner |
- | - | - | B | A-E | *1 | |||
SEIKI Corp. Spear System |
Type B (conventional) |
- | - | - | B | B | |||
EH Type | - | - | - | B | G | *2 | |||
Mold-Masters Corp Ltd. Master shot |
- | - | B | A-G | |||||
FISA Corp. Plagate System |
- | - | - | B | A |
E = Excellent : Application examples to SUMIKASUPER LCP are available.
G = Good : Applicable to SUMIKASUPER LCP.
A = Average : There are no examples of application to SUMIKASUPER LCP.
B = Bad : Not applicable to SUMIKASUPER LCP
*1 : | When using multiple gates and extension nozzles for a sub-runner,it is better to control the temperature of each extension nozzle individually. It is also good to control the temperature of each nozzle individually for the molding of E5000 series which require high molding temperature. |
*2 : | Internal heating system for chip part |