Recycling of SUMIKASUPER LCP

Recycling of LCP

When molded under appropriate molding conditions, SUMIKASUPER LCP exhibits excellent thermal stability and has excellent retention of physical properties even when recycled and reused repeatedly. Since SUMIKASUPER LCP's strength and other properties are expressed through orientation, its electrical properties, flammability, chemical resistance, etc. do not change significantly when recycled and reused.
We evaluated the retention of physical properties by changing the recycle ratio for a representative grade of SUMIKASUPER LCP. At 30% recycling, a slight decrease in strength was observed in the early stages, but there was almost no change after the third recycling. At this time, the strength retention rate was over 90%, and almost no change in shrinkage rate was observed.

Property retention rate of representative grades when regenerated

The physical property retention rate of the representative grade recycled material is shown below when the recycled ratio is changed and the material is repeatedly molded. When using recycled materials, be sure to strictly manage the recycled material and determine the recycled material ratio after fully considering the needs and required quality of the product.

Figure 4-4-1 Relationship between number of recycling cycles and tensile strength retention

Figure 4-4-1 Relationship between number of recycling cycles and tensile strength retention

Figure 4-4-2 Relationship between number of recycles and molding shrinkage rate

Figure 4-4-2 Relationship between number of recycles and molding shrinkage rate

Table 4-4-1 Property retention rate of major grades of SUMIKASUPER LCP when recycled to 50% of virgin materials

(Unit: Retention rate (%))

Measuring method E6007LHF E6807LHF
50% 3 passes 50% 7 passes 50% 3 passes 50% 7 passes
Tensile strength ASTM D638 99 99 94 96
Tensile elongation 97 97 97 99
Bending strength ASTM D790 99 98 98 99
Flexural modulus 99 99 100 99
Izod impact strength unnotched ASTM D256 99 99 100 96
Deflection Temperature under Load 1.82MPa ASTM D648 98 98 99 99
Measuring method E6808UHF SZ6505HF
50% 3 passes 50% 7 passes 50% 3 passes 50% 7 passes
Tensile strength ASTM D638 100 98 91 95
Tensile elongation 100 94 88 92
Bending strength ASTM D790 97 99 99 99
Flexural modulus 98 99 99 99
Izod impact strength unnotched ASTM D256 96 89 100 100
Deflection Temperature under Load 1.82MPa ASTM D648 98 99 99 100

Property retention rate of representative grade (SV6808THF) when changing the recycled material ratio

According to UL regulations, SV6808THF can be regrind up to 70%. Table 4-4-2 shows the property retention rate when the recycled material ratio of SV6808THF is changed. The allowable recycled material ratio varies depending on the product design level, UL standards, automotive standards, etc. Understanding the characteristics of recycled materials and deciding on the recycled material ratio before using them will lead to lower costs and reduced environmental impact.

Evaluation conditions
Injection molding conditions: resin temperature 350℃, mold temperature 130℃
Recycling method: The molded product is crushed in a crusher to produce recycled material.
Recycled material ratio: 25, 50, 70, 80, 100% uniformly mixed with virgin material
Number of views: 1 to 3

Table 4-4-2 Property retention rate when changing the recycle ratio of SV6808THF

Unit: Retention rate (%)
Test method Virgin Material 25% once 25% 3 times 50% once 50% 3 times 70% once 70% 3 times
Specific gravity ASTM D792 100 100 100 100 100 100 100
Mold shrinkage rate (※) MD
TD
Sumitomo Chemical Method 0.22
0.56
0.22
0.56
0.22
0.56
0.22
0.58
0.21
0.57
0.22
0.58
0.21
0.58
Tensile Strength
stretch
ASTM D638 100
100
98
102
100
103
96
99
96
96
96
97
95
96
bending Strength
Elasticity
ASTM D790 100
100
100
101
102
101
99
102
99
101
100
100
96
101
Izod impact strength No notch ASTM D256 100 101 98 96 94 95 81
Deflection Temperature under Load 1.82MPa
0.45MPa
ASTM D648 100
100
99
99
99
100
98
99
99
99
97
99
98
98
Solder temperature resistance Sumitomo Chemical Method 100 100 104 104 104 104 100
Thin wall flow length
100MPa
0.1mm
0.2mm
0.3mm
Sumitomo Chemical Method 100
100
100
100
99
100
104
101
105
104
104
108
104
106
110
105
104
108
113
111
117
150MPa 0.1mm
0.2mm
0.3mm
Sumitomo Chemical Method 100
100
100
103
100
102
102
102
103
106
103
105
102
106
106
108
102
104
111
107
110
Thin-walled bending strength 0.1mm
0.2mm
0.3mm
Sumitomo Chemical Method 100
100
100
96
101
98
95
99
101
99
98
107
101
96
104
99
97
103
95
93
100
Test method 80% once 80% 3 times 100% once 100% 3 times
Specific gravity ASTM D792 100 100 100 100
Mold shrinkage rate (※) MD
TD
Sumitomo Chemical Method 0.22
0.58
0.21
0.58
0.21
0.59
0.21
0.59
Tensile Strength
stretch
ASTM D638 93
94
88
94
92
96
85
82
bending Strength
Elasticity
ASTM D790 96
101
91
101
96
101
88
100
Izod impact strength No notch ASTM D256 90 77 95 63
Deflection Temperature under Load 1.82MPa
0.45MPa
ASTM D648 98
99
97
97
97
98
96
96
Solder temperature resistance Sumitomo Chemical Method 100 100 100 100
Thin wall flow length
100MPa
0.1mm
0.2mm
0.3mm
Sumitomo Chemical Method 102
105
108
111
114
124
109
109
111
118
122
133
150MPa 0.1mm
0.2mm
0.3mm
Sumitomo Chemical Method 107
104
106
107
111
112
109
106
108
113
120
118
Thin-walled bending strength 0.1mm
0.2mm
0.3mm
Sumitomo Chemical Method 98
98
102
99
93
95
94
95
100
97
89
82

*Mold shrinkage is the measured value for a flat test piece of 64mm x 64mm x 3mm.