SUMIKASUPER LCP Selection Guide for Office Automation Applications

What are the fixed parts of OA equipment?

The fusing section of a multifunction printer (MFP) and laser beam printer (LBP) generally uses a method in which powder toner transferred onto paper is fused (fixed) to the paper using high temperature and pressure. As plastic parts, they are broadly classified into two types: "fusing section parts" and "parts surrounding the fusing section."
"Parts of the fixing unit" are parts that support a high-temperature heat source of 200 to 350 degrees Celsius, and parts that are used in close proximity to the heat source. "Parts around the fixing unit" are parts that transport paper before and after fixing, and covers that cover the entire fixing unit.

Required material properties

The "fixing section parts" require different heat resistance temperatures depending on the fixing method, so materials must have the appropriate heat resistance. Parts that support the heat source of the fixing section must have heat storage properties from the perspective of thermal efficiency. In addition, parts that come into direct contact with the high-speed rotating film must have sliding properties.
On the other hand, "parts around the fixing unit" such as guides for transporting paper and covers that cover the entire fixing unit require low warpage to prevent paper jams and to keep the pressure during fixing constant in the entire length direction. In addition, thin-wall flow during molding is also required to achieve thin-walled products.

Grade selection guide for fixing parts of OA equipment (printers, MFPs, LBPs)

For "fuser parts," a wide range of materials can be selected depending on the fusing method, from the ultra-heat-resistant E5000 series to the E6000HF and SV6000HF series that emphasize other characteristics. If heat storage and sliding properties are required, we recommend E5204L, E4205R, and E6205L, which have low thermal conductivity and good surface smoothness.
For "parts around the fixing part", the E6000HF and SV6000HF series are suitable from the perspective of thin-wall flowability. Among them, E6808LHF and SV6808THF are recommended as grades with low warpage and good thin-wall flowability.

Table 6-5-1 SUMIKASUPER LCP grades for office automation applications

Types of parts in the fixing section	Required characteristics	Recommended Grade
Fixing part parts	standard	E6808LHF, E6007LHF-MR, E6006L, E4006L, E5006L, etc.*
	Heat storage, sliding properties	E6205L, E4205R, E5204L
Parts around the fixing section	Low warpage, high fluidity	E6000HF, SV6000HF series (E6808LHF, SV6808THF, etc.)

*Deflection temperature under load: E6808LHF: 274°C, E6007LHF-MR: 269°C, E6006L: 284°C, E4006L: 324°C, E5006L: 355°C

SUMIKASUPER LCP for LED applications

What is the high reflectance grade?

This molding material combines our proprietary LCP and compound technology to achieve both high reflectivity and high mechanical strength.

Features of high reflectance grade

• Excellent heat resistance
  The LED grade uses LCP as the base polymer, which gives it excellent heat resistance. As there is almost no loss in reflectance due to heat, it is suitable as a packaging material for high-brightness, high-power LEDs.
• High self-extinguishing properties
  The base polymer, LCP, has a high limiting oxygen index, so it exhibits UL94 V-0 flame retardancy without the addition of flame retardants.
• Stable molding processability
  Like general grades of LCP, it exhibits stable moldability in thin-wall injection molding.
• Low water absorption
  The base polymer, LCP, has the lowest water absorption of any resin material, so it exhibits excellent moisture absorption and reflow properties.

SZ6709L characteristics table

Table 6-8-1 SZ6709L characteristics table

Item		Test method	unit	SZ6709L
Molded product color	L	-	-	91.0
	a			-0.3
	b			5.5
Reflectivity	640nm	JIS K7105-1981	％	92
	520nm			90
	460nm			88
Water absorption rate		ISO 62	％	0.02
Specific gravity		ASTM D792	-	1.89
Mold shrinkage	MD	Sumitomo Chemical Method	％	0.17
	TD			0.80
Tensile strength		ASTM D638	MPa	115
Tensile elongation		ASTM D638	％	5.0
Bending strength		ASTM D790	MPa	140
Flexural modulus		ASTM D790	MPa	11,000
Izod impact strength		ASTM D256	J/m	310
Deflection temperature under load (1.82MPa)		ASTM D648	℃	275
Solder heat resistance		Sumitomo Chemical Method	℃	300

Reflectance and heat resistance of SZ6709L

Figure 6-8-1 Heat resistance of reflectance of SZ6709L